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STPC0310BTC3 データシート(PDF) 45 Page - STMicroelectronics |
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STPC0310BTC3 データシート(HTML) 45 Page - STMicroelectronics |
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45 / 51 page  BOARD LAYOUT 45/51 Issue 1.2 The PBGA Package also dissipates heat through peripheral ground balls. When a heat sink is placed on the device, heat is more uniformely spread throughout the moulding increasing heat dissipation through the peripheral ground balls. The more via pads are connected to each ground ball, the more heat is dissipated . The only limita- tion is the risk of lossing routing channels. Figure 6-5 shows a routing with a good trade off between thermal dissipation and number of rout- ing channels. Figure 6-4. Optimum layout for central ground ball Via to Ground layer Pad for ground ball Clearance = 6mil diameter = 25 mil hole diameter = 14 mil Solder mask diameter = 33 mil External diameter = 37 mil connections = 10 mil Figure 6-5. Global ground layout for good thermal dissipation Ground pad Via to ground layer |
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