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STPC0366BTI3 データシート(PDF) 46 Page - STMicroelectronics |
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STPC0366BTI3 データシート(HTML) 46 Page - STMicroelectronics |
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46 / 51 page  BOARD LAYOUT 46/51 Issue 1.2 A local ground plane on opposite side of the board as shown in Figure 6-6 improves thermal dissipa- tion. It is used to connect decoupling capacitances but can also be used for connection to a heat sink or to the system’s metal box for better dissipation. This possibility of using the whole system’s box for thermal dissipation is very usefull in case of high temperature inside the system and low tempera- ture outside. In that case, both sides of the PBGA should be thermally connected to the metal chas- sis in order to propagate the heat through the met- al. Figure 6-7 illustrates such an implementation. Figure 6-6. Bottom side layout and decoupling Ground plane for thermal dissipation Via to ground layer Figure 6-7. Use of metal plate for thermal dissipation Metal planes Thermal conductor Board Die |
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