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ST3237EBPR データシート(PDF) 12 Page - STMicroelectronics |
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ST3237EBPR データシート(HTML) 12 Page - STMicroelectronics |
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12 / 18 page  Package mechanical data ST3237EB 12/18 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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