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17511A データシート(PDF) 5 Page - Freescale Semiconductor, Inc |
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17511A データシート(HTML) 5 Page - Freescale Semiconductor, Inc |
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5 / 17 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 5 17511A ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit Motor Supply Voltage VM -0.5 to 8.0 V Charge Pump Output Voltage VCRES -0.5 to 14.0 V Logic Supply Voltage VDD -0.5 to 7.0 V Signal Input Voltage (EN, IN1, IN2, GIN) VIN -0.5 to VDD+0.5 V Driver Output Current Continuous Peak (1) IO IOPK 1.0 3.0 A ESD Voltage (2) Human Body Model Machine Model VESD1 VESD2 ±1800 ±100 V Storage Temperature Range TSTG -65 to 150 °C Operating Ambient Temperature TA -20 to 65 °C Operating Junction Temperature TJ -20 to 150 °C Thermal Resistance (3) 24 Pin QFN 16 Pin VMFP RθJA 50 150 °C/W Power Dissipation (4) 24 Pin QFN 16 Pin VMFP PD 2500 830 mW Soldering Temperature (5) TSOLDER 260 °C Peak Package Reflow Temperature During Reflow (6), (7) TPPRT Note 7 °C Notes 1. TA = 25°C, 10 ms pulse width at 200 ms intervals. 2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 3. QFN24: 45 x 30 x 1 [mm] glass EPOXY board mount. (See: recommended heat pattern) VMFP16: 37 x 50 x 1.6 [mm] glass EPOXY board mount. When the exposed pad is bonded, Rsj will not be performed. 4. Maximum at TA = 25°C. When the exposed pad is bonded, Rsj will not be performed. 5. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. |
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