DICE/DWF SPECIFICATION

2

RH1573K

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

© LINEAR TECHNOLOGY CORPORATION 2008

LT 0808 • PRINTED IN USA

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information

on dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

I.D.No. 66-13-rh1573

PARAMETER

CONDITIONS

MIN

MAX

UNITS

SHDN Pin Threshold Voltage

1

1.5

V

SHDN Pin Current

300

μA

LATCH Pin Latch-Off Threshold Voltage

1.1

1.8

V

LATCH Pin Charging Current

4

10

μA

LATCH Pin Latching Current

0.85

mA

Disable

0.55

0.8

V

Input Quiescent Current

2.8

mA

Minimum Input Voltage for Bias Operation

2.4

V

Note 1: For circuit operation and application information refer to LT1573

data sheet.

Note 2: For post radiation performance contact factory.