DICE/DWF SPECIFICATION

2

RH1028M/RH1128M

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

© LINEAR TECHNOLOGY CORPORATION 2008

LT 0908 • PRINTED IN USA

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information

on dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

I.D.No. 66-13-1028

Note 1: Input offset voltage measurements are performed by automatic

test equipment approximately 0.5 seconds after application of power.

SYMBOL

PARAMETER

CONDITIONS

MIN

MAX

UNITS

SR

Slew Rate

11

4.5

V/μs

V/μs

Supply Current

10.5

mA