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POST OFFICE BOX 655303

Copyright

 2003 Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Data sheet acquired from Harris Semiconductor

SCHS115D – Revised September 2003

The CD4093B types are supplied in 14-lead

hermetic dual-in-line ceramic packages (F3A

suffix), 14-lead dual-in-line plastic packages (E

suffix), 14-lead small-outline packages (M, MT,

M96, and NSR suffixes), and 14-lead thin shrink

small-outline packages (PW and PWR suffixes).

PACKAGE THERMAL IMPEDANCE,

E package

80

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package

86

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package

76

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NOTE 1:

Package thermal impedance is calculated in accordance with JESD 51-7.