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CLC1003 データシート(PDF) 14 Page - Cadeka Microcircuits LLC. |
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CLC1003 データシート(HTML) 14 Page - Cadeka Microcircuits LLC. |
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14 / 16 page ![]() Data Sheet ©2004-2008 CADEKA Microcircuits LLC www.cadeka.com 14 The first place to start is to determine the source resis- tance. If it is very small an additional resistance may need to be added to keep the values of Rf and Rg to practical levels. For this analysis we assume that Rt is the total re- sistance present on the non-inverting input. This gives us one equation that we must solve: Rt = Rg||Rf This equation can be rearranged to solve for Rg: Rg = (Rt * Rf) / (Rf - Rt) The other consideration is desired gain (G) which is: G = (1 + Rf/Rg) By plugging in the value for Rg we get Rf = G * Rt And Rg can be written in terms of Rt and G as follows: Rg = (G * Rt) / (G - 1) The complete input offset equation is now only dependent on the voltage offset and input offset terms given by: VI OS = V IO ( ) 2 + IOS ∗ RT ( ) 2 And the output offset is: VO OS = G ∗ V IO ( ) 2 + I OS ∗ RT ( ) 2 Noise analysis The complete equivalent noise circuit is shown in Figure 7. Rg Rf RL – + CLC1003 + – + – Rg + – + – + – Figure 7: Complete Equivalent Noise Circuit The complete noise equation is given by: v 2 o = v 2 orext + en 1 + RF RG 2 + ibp∗ RT 1 + RF RG 2 + ibn∗ RF ( ) 2 Where Vorext is the noise due to the external resistors and is given by: = en 1 + RF RG 2 + eG ∗ RF RG 2 + e 2 F v 2 o The complete equation can be simplified to: = 3 ∗ 4kT ∗ G ∗ RT ( ) + enG ( ) 2 + 2 ∗ in∗RT ( ) 2 v 2 o It’s easy to see that the effect of amplifier voltage noise is proportionate to gain and will tend to dominate at large gains. The other terms will have their greatest impact at large Rt values at lower gains. Layout Considerations General layout and supply bypassing play major roles in high frequency performance. CADEKA has evaluation boards to use as a guide for high frequency layout and as aid in device testing and characterization. Follow the steps below as a basis for high frequency layout: • Include 6.8µF and 0.1µF ceramic capacitors for power supply decoupling • Place the 6.8µF capacitor within 0.75 inches of the power pin • Place the 0.1µF capacitor within 0.1 inches of the power pin • Remove the ground plane under and around the part, especially near the input and output pins to reduce para- sitic capacitance • Minimize all trace lengths to reduce series inductances Refer to the evaluation board layouts below for more in- formation. Evaluation Board Information The following evaluation boards are available to aid in the testing and layout of these devices: Evaluation Board # Products CEB002 CLC1003 in SOT23-5 CEB003 CLC1003 in SOIC-8 |
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