November 2006

ASM3P2779A

rev 3.2

Low Power Peak EMI Reducing Solution

2 of 12

Notice: The information in this document is subject to change without notice.

Pin Configuration (6-pin TSOT- 23 Package)

Pin Description

Pin#

Pin Name

Type

Description

1

PD

I

Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not

used.

2

XOUT

O

Crystal connection. If using an external reference, this pin must be left unconnected.

3

XIN / CLKIN

I

Crystal connection or external reference frequency input. This pin has dual functions. It

can be connected either to an external crystal or an external reference clock.

4

VDD

P

Power supply for the entire chip.

5

ModOUT

O

Spread spectrum clock output.

6

VSS

P

Ground connection.

Pin Configuration (8-pin SOIC and TSSOP Packages)

Pin Description

Pin#

Pin Name

Type

Description

1

XIN/CLKIN

I

Crystal connection or external reference frequency input. This pin has dual functions. It

can be connected either to an external crystal or an external reference clock.

2

XOUT

O

Crystal connection. If using an external reference, this pin must be left unconnected.

3

PD

I

Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not

used.

4

NC

-

No connect.

5

VSS

P

Ground connection.

6

ModOUT

O

Spread spectrum clock output.

7

NC

-

No connect.

8

VDD

P

Power supply for the entire chip.

VSS

ModOUT

XIN / CLKIN

NC

XOUT

1

2

3

4

5

6

7

8

ASM3P2779A

PD

NC

VDD

XOUT

1

2

3

4

5

6

ASM3P2779A

PD

XIN / CLKIN

VDD

ModOUT

VSS