TPS2201, TPS2201Y

DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES

FOR PARALLEL PCMCIA CONTROLLERS

SLVS094B – AUGUST 1994 – REVISED AUGUST 1995

6–3

POST OFFICE BOX 655303

TPS2201Y chip information

This chip, when properly assembled, displays characteristics similar to the TPS2201. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

204

142

TPS2201Y

(2)

(28)

(1)

(3)

(29)

(30)

(27)

(4)

5V

5V

5V

A_VPP_PGM

A_VPP_VCC

B_VPP_PGM

B_VPP_VCC

B_VCC5

(6)

(5)

(7)

(8)

A_VCC5

A_VCC3

12V

AVPP

(10)

(9)

(11)

(12)

AVCC

AVCC

AVCC

GND

(14)

(13)

(15)

APWR_GOOD

SHDN

3V

(24)

(25)

(26)

(23)

B_VCC3

VDD

12V

BVPP

(20)

(21)

(22)

(19)

BVCC

BVCC

BVCC

BPWR_GOOD

(16)

(17)

(18)

OC

3V

3V

(2)

(1)

(3)

(4)

(6)

(5)

(7)

(8)

(10)

(9)

(11)

(12)

(14)

(13)

(15)

(20)

(21)

(22)

(19)

(16)

(17)

(18)

(28)

(29)

(30)

(27)

(24)

(25)

(26)

(23)