STM1066

Package mechanical data

15/20

6

Package mechanical data

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 12.

Flip chip 6-bump, package mechanical outline

Flip chip (6-bump)