AD9267EBZ datasheet(7/24 Pages) AD

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AD9267

Rev. 0 | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DVDD to DGND

−0.3 V to +2.0 V

DRVDD to DGND

−0.3 V to +3.9 V

AGND to DGND

−0.3 V to +0.3 V

AVDD to DRVDD

−3.9 V to +2.0 V

CVDD to CGND

−0.3 V to +2.0 V

CGND to DGND

−0.3 V to +0.3 V

D0±A to D3±A to DGND

−0.3 V to +2.0 V

D0±B to D3±B to DGND

−0.3 V to +2.0 V

DCO± to DGND

−0.3 V to +2.0 V

OR±A, OR±B to DGND

−0.3 V to +2.0 V

PDWNA to DGND

−0.3 V to +3.9 V

PDWNB to DGND

−0.3 V to +3.9 V

PLLMULTx to DGND

−0.3 V to +3.9 V

SDIO to DGND

−0.3 V to +3.9 V

CSB to AGND

−0.3 V to +3.9 V

SCLK to AGND

−0.3 V to +3.9 V

VIN±A, VIN±B to AGND

−0.3 V to +2.5 V

CLK+, CLK− to CGND

−0.3 V to +2.0 V

Environmental

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the PCB

increases the reliability of the solder joints, maximizing the

thermal capability of the package.

Typical θJA and θJC are specified for a 4-layer board in still air.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, metal in direct contact with the package leads from

metal traces, through holes, ground, and power planes reduces

the θJA.

Table 6. Thermal Resistance

Package Type

θJA

Unit

64-Lead LFCSP (CP-64-4)

°C/W

ESD CAUTION

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