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MCP6071 データシート(PDF) 21 Page - Microchip Technology |
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MCP6071 データシート(HTML) 21 Page - Microchip Technology |
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21 / 34 page  © 2009 Microchip Technology Inc. DS22142A-page 21 MCP6071/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC (150 mil) (MCP6071, MCP6072) Example: XXXXXXXX XXXXYYWW NNN MCP6071E SN^^0910 256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e Example: AHE 910 25 8-Lead 2x3 TDFN (MCP6071, MCP6072) XXX YWW NN 14-Lead TSSOP ( MCP6074) Example: 14-Lead SOIC (150 mil) ( MCP6074) Example: XXXXXXXXXX YYWWNNN XXXXXX YYWW NNN MCP6074E 0910 256 XXXXXXXXXX MCP6074 0910256 E/SL^^ 3 e |
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