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MPC8533ECHXARJB データシート(PDF) 95 Page - Freescale Semiconductor, Inc |
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MPC8533ECHXARJB データシート(HTML) 95 Page - Freescale Semiconductor, Inc |
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95 / 116 page  MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 95 Thermal Figure 56. System Level Thermal Model for MPC8533E (Not to Scale) The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to determine the optimal grid for their specific case. Solder and Air (29 × 29 × 0.58 mm) Kx 0.034 W/m•K Ky 0.034 Kz 12.1 Table 67. MPC8533EThermal Model (continued) Conductivity Value Units Bump Underfill Section A-A A A Top View Die Substrate Solder/Air |
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