2 (6)

DA6013.000

24 April, 2008

PAD LAYOUT

INP4

760 µm

MAS

INP3

INP2

INP1

VDD

OUT4

OUT3

OUT2

OUT1

VSS

6013

DIE size = 760 µm x 1140 µm; PAD size = 80 x 80 µm

Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left

floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly

are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

Pad Identification

Name

X-coordinate

[µ

µ

µ

µ

m]

Y-coordinate

[µ

µ

µ

µ

m]

Note

Stepper Motor Driver Input 1

INP1

152 µm

941 µm

Stepper Motor Driver Input 2

INP2

152 µm

755 µm

Stepper Motor Driver Input 3

INP3

152 µm

569 µm

Stepper Motor Driver Input 4

INP4

152 µm

382 µm

Supply Ground

VSS

152 µm

194 µm

Stepper Motor Driver Output 4

OUT4

609 µm

216 µm

Stepper Motor Driver Output 3

OUT3

609 µm

407 µm

Stepper Motor Driver Output 2

OUT2

609 µm

597 µm

Stepper Motor Driver Output 1

OUT1

609 µm

788 µm

Supply Voltage

VDD

609 µm

938 µm