ISO7421 datasheet(10/18 Pages) TI

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REGULATORY INFORMATION

LIFE EXPECTANCY vs WORKING VOLTAGE

100

250

500

750

1000

– WorkingVoltage – V

IORM

880

120

at560V

IORM

28 Years

G001

IEC SAFETY LIMITING VALUES

PACKAGE THERMAL CHARACTERISTICS

ISO7421, ISO7421M

SLLS984 – JUNE 2009....................................................................................................................................................................................................... www.ti.com

VDE

CSA

Certified according to IEC

Approved under CSA Component

Recognized under 1577 Component Recognition

60747-5-2

Acceptance Notice

Program(1)

File number: pending (40016131)

File number: pending (1698195)

File number: pending (E181974)

(1)

Production tested

≥ 3000 Vrms for 1 second in accordance with UL 1577.

Figure 4. Life Expectancy vs Working Voltage

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of

the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat

the die and damage the isolation barrier, potentially leading to secondary system failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

JA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C

124

Safety input, output, or supply

current

JA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C

190

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum

Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Characteristics table is that of a device installed in the JESD51-3, Low-Effective-Thermal-Conductivity

Test Board for Leaded Surface-Mount Packages and is conservative. The power is the recommended maximum

input voltage times the current. The junction temperature is then the ambient temperature plus the power times

the junction-to-air thermal resistance.

(over recommended operating conditions unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Low-K thermal resistance(1)

212

Junction-to-air thermal resistance

°C/W

High-K thermal resistance(1)

122

Junction-to-board thermal resistance

°C/W

(1)

Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages

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