American Accurate Components, Inc.

POWER SPLITTER – High Precision Power Chip Divider

The content of this specification may change without notification 10/23/08

188 Technology Drive, Unit H, Irvine, CA 92618

TEL: 949-453-9888

FAX: 949-453-8889

2

*** Custom Designs Available

DERATING CURVE – Circuit A

DERATING CURVE – Circuit B

DIMENSIONS (mm)

Series

L

W

a

b

t

PPS-05A

1.00 ± 0.2

0.50 ± 0.2

0.4 ± 0.1

0.30 ± 0.1

0.4 ± 0.10

PPS-16A

1.60 ± 0.2

0.80 ± 0.2

0.4 ± 0.1

0.30 ± 0.1

0.4 ± 0.10

PPS-10A

2.00 ± 0.2

1.25±0.2

0.4 ± 0.1

0.30 ± 0.1

0.4 ± 0.10

PPS-18A

3.20 ± 0.2

1.60 ± 0.2

0.3 ± 0.1

0.35 ± 0.1

0.4 ± 0.10

PPS-12A

0.50 ± 0.2

2.5 ± 0.2

0.35 ± 0.1

0.65 ± 0.1

0.8 ± 0.15

SCHEMATIC LEGEND

SCHEMATIC – Circuit A

1. Thin Film Resistor

2. Overcoat Resin

3. Terminal (SnPb or Lead Free)

4. Marking (dot to indicate direction & bar)

5. Alumina Substrate

PERFORMANCE

Item

Test Condition

Tolerance

Short Time Overload

2.5 times of the rated voltage shall be applied for 5 seconds.

±0.1%

Rated Load Life

Apply rated voltage for 90 min followed by a pause of 30 min at 70±3°C for 1000 hours.

±0.25%

Moisture Load Life

The chip divider is applied rated voltage for 90 min at 60±2°C 90～95%RH for 1000 hours.

±0.25%

Temperature Cycle

[-55°C (30min)-R.T.(3min)-+125°C(30min)-R.T.(3min)] is repeated 5 cycles.

±0.1%

Soldering Heat Resistance

Leave NR in melt solder of 260±5°C for 10±1 seconds.

±0.1%

Strength Between Terminals

Distance between fulcrums : 90mm; Bending width : 3mm; Substrate: Glass epoxy t=1.6mm

±0.1%

Solderability

Leave NR in melted solder of 235±5°C for 3±0.5 seconds.

≥95% of the surface should be wet

Insulation Resistance

A minute after 500 DC

≥ 1000M Ω