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LA112B-SRF.DBK-R1-PF データシート(PDF) 7 Page - LIGITEK electronics co., ltd.

部品番号 LA112B-SRF.DBK-R1-PF
部品情報  LED ARRAY
PDF  7 Pages
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メーカー  LIGITEK [LIGITEK electronics co., ltd.]
ホームページ  http://www.ligitek.com
Logo LIGITEK - LIGITEK electronics co., ltd.

LA112B-SRF.DBK-R1-PF データシート(HTML) 7 Page - LIGITEK electronics co., ltd.

  LA112B-SRF.DBK-R1-PF Datasheet HTML 1Page - LIGITEK electronics co., ltd. LA112B-SRF.DBK-R1-PF Datasheet HTML 2Page - LIGITEK electronics co., ltd. LA112B-SRF.DBK-R1-PF Datasheet HTML 3Page - LIGITEK electronics co., ltd. LA112B-SRF.DBK-R1-PF Datasheet HTML 4Page - LIGITEK electronics co., ltd. LA112B-SRF.DBK-R1-PF Datasheet HTML 5Page - LIGITEK electronics co., ltd. LA112B-SRF.DBK-R1-PF Datasheet HTML 6Page - LIGITEK electronics co., ltd. LA112B-SRF.DBK-R1-PF Datasheet HTML 7Page - LIGITEK electronics co., ltd.  
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LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Description
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Reference
Standard
Test Condition
Test Item
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Operating Life Test
Reliability Test:
JIS C 7021: B-12
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
1.Ta=-40
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
Low Temperature
Storage Test
1.Ta=65
℃±5℃
2.RH=90 %~95%
3.t=240hrs
±2hrs
Thermal Shock Test
High Temperature
High Humidity Test
1.T.Sol=260
℃±5℃
2.Dwell time= 10
±1sec.
Solder Resistance
Test
1.T.Sol=230
℃±5℃
2.Dwell time=5
±1sec
Solderability Test
1.Ta=105
℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
1.Ta=105
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
High Temperature
Storage Test
MIL-STD-883:1008
JIS C 7021: B-10
PART NO. LA112B/SRF.DBK-R1-PF



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