SAMWHA CAPACITOR Co., Ltd.

138

Ceramic Type

Appendix

SMD Type Packing

140

CHIP B/I Packing

142

SMDC Packing

144

Mechanical test and Environmental Substance

No.

Item

Requirement

Test Conditions

Adhesive Strength of

Terminal

1

Solder the capacitor to the testing jig (glass epoxy

board) shown in Fig. 2 using a eutectic solder. Then

apply 5 N force in the direction of the arrow. The

soldering should be used the reflow method and

should be conducted with care so that the soldering is

uniform and free of defects such as heat shock.

No removal of the termination or other

defect should occur.

SCC Type

SCK, SCG, SSC,

SSD Type

Vibration

Resistance

Appearance

Capacitance

Change

More than 1000MΩ

2

The capacitor should be subjected to a simple

harmonic motion having a total amplitude of 1.5mm,

the frequency being varied uniformly between the

approximate limits of 10 and 55Hz. The frequency

range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should

be applied for a period of 2hrs. in each 3mutually

perpendicular directions (total of 6hrs.)

No. visible damage

±5% or ±0.5 pF

B : With ± 10%

Whichever is larger

E : With ± 20%

from initial measurement

F : With ± 30%

Dissipation

Factor (tan δ,Q)

I.R

Q ≥ 200

B,E : 5% Max.

F

: 7.5% Max.

Fig.2

Fig.4

Bending

Strength

Appearance

Capacitance

Change

3

Solder the capacitor to the testing jig (glass epoxy

board) shown in Fig. 3 using a eutectic solder.

Then apply a force in the direction shown in Fig. 4.

The soldering should be done either with an iron or

using the reflow method and should be conducted

with care so that the soldering is uniform and free of

defects such as heat shock.

No. visible damage

±5% or ±0.5 pF

B : With ± 10%

Whichever is larger

E : With ± 20%

from initial measurement

F : With ± 30%

Solder

Heat

Resistance

Appearance

Capacitance

Change

Dielectric

Strength

5

No. visible damage

±5% or ±0.5 pF

B : With ± 5%

Whichever is larger

E : With ± 15%

from initial measurement

F : With ± 20%

No. Failure

Fig.3

Solderability Test

4

The regulation of

environmental pollution

materials.

6

Soldering Method : Reflow Soldering

- Maximum Temperature : 250℃ max.

(245± 5℃, 5± 0.5 sec.)

- Preheating Temperature : 150~180℃, 60~180 sec.

Soldering Method : Reflow Soldering

- Maximum Temperature : 250℃ max.

(245± 5℃, 5± 0.5 sec.)

- Preheating Temperature : 150~180℃, 60~180 sec.

- After testing, The capacitors shall be subjected to the

standard test condition for a period 24 hours and shall

be measured.

Visual examination terminals area shall

be at least 90% covered with a new

solder coating

※ Never use materials mentioned below in high voltage products regulated this document.

※ Pb, Hg, Cr+6, PBB, PBDE : 100ppm, Cd : 5ppm

※ Exception : - Pb of solder : <1000ppm

- Pb of ceramic(dielectric)