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Revision 1.04

10 - 14

AS1371

Datasheet - D e t a i l e d D e s c r i p t i o n

Operating Region and Power Dissipation

Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature

difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is

calculated by:

Maximum power dissipation is calculated by:

Where:

Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin

should be connected to the system ground using a large pad or a ground plane.

(EQ 2)

PI

OUT

V

IN

V

OUT

–

()

×

=

(EQ 3)

P

MAX

T

J

T

AMB

–

θ

JB

θ

JA

+

-------------------------

=