20-30GHz Medium Power Amplifier

CHA3092RBF

Ref. : DSCHA3092RBF2057 -26-Feb.-01-

7/8

Specifications subject to change without notice

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The RF ports comprise a DC blocking capacitor on chip level. The DC connections

include a first level of DC decoupling capacitors (typically 120pF) in the package.

However, all DC bias ports should be additionally connected to ground with 10nF

capacitors at board level to prevent the MMIC from oscillations. These parts should

be placed close to the SMD leadless package. If the same bias is required at

different DC ports, the lines should only be connected behind these block capacitors.

Further information on the application of the SMD leadless packages for GaAs

monolithic microwave ICs are given in the UMS Application Note AN0005.