BA3472F,BA3472FV,BA3472FVM

Technical Note

7/9

www.rohm.com

2009.11 - Rev.B

© 2009 ROHM Co., Ltd. All rights reserved.

●Notes for use

1)Unused circuits

When there are unused circuits it is recommended that they are

connected as in Fig.29, setting the non-inverting input terminal

to a potential within input common-mode voltage range (Vicm).

2) Input terminal voltage

Applying GND + 36V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input voltage is

within the common mode input voltage range of the electric characteristics.

3) Power supply (single / dual)

The op-amp operates when the specified voltage supplied is between

VCC and VEE. Therefore, the single supply op-amp can be used as

dual supply op-amp as well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to

a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the

power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design.

Refer to the thermal derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs,

the output and the power supply, or the output and GND may result in IC destruction.

6) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

7) Radiation

This IC is not designed to withstand radiation.

8) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical

characteristics due to piezoelectric (piezo) effects.

9) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after

every process is recommended. In addition, when attaching and detaching the jig during the inspection phase,

ensure that the power is turned OFF before inspection and removal . Furthermore, please take measures against

ESD in the assembly process as well as during transportation and storage.

10)Output capacitor

Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,

causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation

due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance

less than 0.1µF.

VCC

VEE

－

＋

同相入力電圧

範囲内の電位

図1 未使用回路の処理例

Fig.29Unused circuit example

Please keep this

potential in Vicm