ADCLK944BCPZ-R7 datasheet(5/12 Pages) AD

5 / 12 page

ADCLK944

Rev. 0 | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

VCC − VEE

6.0 V

Input Voltage

CLK, CLK

VEE − 0.5 V to VCC + 0.5 V

CLK to CLK

±1.8 V

Input Termination, VT to CLK, CLK

±2 V

Input Current, CLK, CLK to VT Pin

(CML, LVPECL Termination)

±40 mA

Maximum Voltage on Output Pins

VCC + 0.5 V

Maximum Output Current

35 mA

Voltage Reference (VREF)

VCC to VEE

Operating Temperature

Ambient Range

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

the top center of the package.

ΨJT is as indicated in Table 5.

PD is the power dissipation.

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order approx-

imation of TJ using the following equation:

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJB are provided in Table 5 for package comparison

and PCB design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 5.

Parameter

Symbol

Description

Value1

Unit

Junction-to-Ambient Thermal Resistance

Still Air

θJA

Per JEDEC JESD51-2

0.0 m/sec Airflow

°C/W

Moving Air

θJMA

Per JEDEC JESD51-6

1.0 m/sec Airflow

°C/W

2.5 m/sec Airflow

°C/W

Junction-to-Board Thermal Resistance

θJB

Per JEDEC JESD51-8

Moving Air

1.0 m/sec Airflow

°C/W

Junction-to-Case Thermal Resistance (Die-to-Heat Sink)

θJC

Per MIL-STD-883, Method 1012.1

Still Air

0.0 m/sec Airflow

1.5

°C/W

Junction-to-Top-of-Package Characterization Parameter

ΨJT

Still Air

Per JEDEC JESD51-2

0.0 m/sec Airflow

2.0

°C/W

1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine whether they are similar to those assumed in these calculations.

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