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ADP151ACBZ-1.2-R7 データシート(PDF) 18 Page - Analog Devices |
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ADP151ACBZ-1.2-R7 データシート(HTML) 18 Page - Analog Devices |
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18 / 24 page ![]() ADP151 Rev. 0 | Page 18 of 24 In the case where the board temperature is known, use the thermal characterization parameter, ΨJB, to estimate the junction temperature rise (see Figure 49 and Figure 50). Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the following formula: TJ = TB + (PD × ΨJB) (5) The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package and 43°C/W for the 5-lead TSOT package. 140 120 100 80 60 40 20 0 0.3 4.8 4.3 3.8 3.3 2.8 2.3 1.8 1.3 0.8 VIN – VOUT (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 50mA ILOAD = 100mA ILOAD = 150mA ILOAD = 200mA MAXIMUM JUNCTION TEMPERATURE Figure 49. WLCSP, TA = 85°C 140 120 100 80 60 40 20 0 0.3 4.8 4.3 3.8 3.3 2.8 2.3 1.8 1.3 0.8 VIN – VOUT (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 50mA ILOAD = 100mA ILOAD = 150mA ILOAD = 200mA MAXIMUM JUNCTION TEMPERATURE Figure 50. TSOT, TA = 85°C |
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