SS24 datasheet(4/28 Pages) AD

4 / 28 page

ADP2300/ADP2301

Rev. 0 | Page 4 of 28

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN

−0.3 V to +28 V

−1.0 V to +28 V

BST to SW

−0.6 V to +6 V

BST

−0.3 V to +28 V

−0.3 V to +3.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all voltages are

referenced to GND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance1

Package Type

θJA

θJC

Unit

6-Lead TSOT

186.02

66.34

°C/W

and

are measured using natural convection on a JEDEC 4-layer board.

ESD CAUTION

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