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Silicon Standard Corporation or any third parties.

Rev.2.01 6/06/2003

SS8046

TO 220F-4 Package (long lead)

Note:

1. Lead frame material: TAMAC-4

2. Solder plating thickness: 10

±5µm

3. Package body size include mold flash and gate burr

4. Tolerance

±0.1mm unless otherwise specified

5. End flash Max. 0.05mm

6. Mismatch Max. 0.05mm

7. Misalignment Max. 0.05mm

8. Epoxy molding compound: SUMITOMO 6300H or equivalent

9. Matte finish Ra: 0.2µm~0.8µm top and bottom surface

DIMENSION IN MM

DIMENSION IN INCH

SYMBOL

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

A

4.42

4.57

4.72

0.174

0.180

0.186

A1

2.69

2.79

2.89

0.106

0.110

0.114

A2

1.68

1.78

1.88

0.066

0.070

0.074

D

10.00

10.10

10.20

0.400

0.404

0.408

E

6.25

6.35

6.45

0.246

0.250

0.254

E1

8.54

8.64

8.74

0.336

0.340

0.344

L

13.70

13.90

14.10

0.539

0.547

0.555

C

-----

0.48

-----

-----

0.019

-----

e

-----

2.54(TYP)

-----

-----

0.1(TYP)

-----

b

-----

0.635(TYP)

-----

-----

0.025(TYP)

-----

?

4

°

7

°

11

°

4

°

7

°

11

°

D

E

b

E1

2.8

± 0.15

e

A

A1

C

A2

L

D

E

b

E1

2.8

± 0.15

e

A

A1

C

A2

L