BAS16_SER_5

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 05 — 25 August 2008

5 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Device mounted on an FR4 PCB with 60

µm copper strip line.

[3]

Single diode loaded.

[4]

[5]

Reflow soldering is the only recommended soldering method.

[6]

Soldering point of cathode tab.

[7]

[8]

Soldering points at pins 4, 5 and 6.

6.

Thermal characteristics

Per device

junction temperature

-

150

°C

ambient temperature

−65

+150

°C

storage temperature

−65

+150

°C

Table 6.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

BAS16

[1] -

-

500

K/W

BAS16H

[2][3] -

-

330

K/W

[3][4] -

-

150

K/W

BAS16J

[3][4] -

-

230

K/W

BAS16L

[2][3] -

-

500

K/W

BAS16VV

[2][3]

[5]

-

-

700

K/W

[3][4]

[5]

-

-

410

K/W

BAS16W

[1] -

-

625

K/W

thermal resistance from

junction to tie-point

BAS16

-

-

330

K/W

BAS16W

-

-

300

K/W