PCF2113DUSLASH2SLASHF4 datasheet(61/65 Pages) NXP

61 / 65 page

PCF2113_FAM_4

Product data sheet

Rev. 04 — 4 March 2008

61 of 65

NXP Semiconductors

PCF2113x

LCD controllers/drivers

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 42.

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”.

Table 30.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

MSL: Moisture Sensitivity Level

Fig 42. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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