LNK454 datasheet(6/12 Pages) POWERINT

6 / 12 page

Rev. A 06/10

LNK454/456-458/460

www.powerint.com

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

PRELIMINARY

Parameter

Symbol

Conditions

SOURCE = 0 V; T

J = -40 to +125 °C

(Unless Otherwise Specified)

Min

Typ

Max

Units

Control Functions

Maximum Output

Frequency

MAX

J = 25 °C

Average

110

122

134

kHz

Peak-Peak Jitter

Minimum Output

Frequency

MIN

J = 25 °C

Average

25.8

28.7

31.6

kHz

Peak-Peak Jitter

Maximum Switch

ON-Time

ON(MAX)

J = 25 °C

5.74

µs

Minimum Switch

ON-Time

ON(MIN)

J = 25 °C

1.18

µs

ON-Time Extension

EXT

5.2

µs

Maximum Duty Cycle

MAX

FEEDBACK Pin Voltage

J = 25 °C

275

290

305

FEEDBACK Pin Voltage

Triggering Cycle

Skipping Mode

FB(SK)

520

FEEDBACK Pin Voltage

for IC Latch-OFF

FB(LO)

2000

Feedback Pull-up

Current

-1.3

-1.0

-0.7

µA

Absolute Maximum Ratings(1,4)

DRAIN Pin Peak Current: LNK454................. 400 mA (750 mA)

LNK456................850 mA (1450 mA)

LNK457 ............. 1350 mA (2000 mA)

LNK458..............1750 mA (2650 mA)

LNK460..............2700 mA (5100 mA)

DRAIN Pin Voltage ………………………............. -0.3 V to 725 V

FEEDBACK Pin Voltage ……………………… ............ -0.3 to 9 V

BYPASS Pin Voltage ……………………… ................. -0.3 to 9 V

Lead Temperature(3) ................................................................260

°C

Storage Temperature …………………................... -65 to 150 °C

Operating Junction Temperature(2).........................-40 to 150 °C

Notes:

1. All voltages referenced to SOURCE, T

A = 25 °C.

2. Normally limited by internal circuitry.

3. 1/16 in. from case for 5 seconds.

4. The Absolute Maximum Ratings specified may be applied,

one at a time without causing permanent damage to the

product. Exposure to Absolute Maximum Ratings for

extended periods of time may affect product reliability.

Thermal Resistance

Thermal Resistance: D (SO-8C) Package:

(

JA) .................................. 100 °C/W

(1)

, 80

°C/W(2)

(

JC) ............................................... ........ 30 °C/W

(3)

V (eDIP) Package:

(

JA) .................................... 68 °C/W

(1)

, 58

°C/W(2)

(

JC) ............................................... ...........2 °C/W

(4)

Notes:

1. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610g/m2) copper clad,

with no external heat sink attached.

2. Soldered to 1 sq. in. (645 mm2), 2 oz. (610g/m2) copper clad,

with no external heat sink attached.

3. Measured on the SOURCE pin close to plastic interface.

4. Measured at the surface of exposed pad.

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