ADT7320UCPZ-R2 datasheet(5/24 Pages) AD

5 / 24 page

Preliminary Technical Data

ADT7320

Rev. PrA | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VDD to GND

−0.3 V to +7 V

DIN Input Voltage to GND

−0.3 V to VDD + 0.3 V

DOUT Voltage to GND

−0.3 V to VDD + 0.3 V

SCLK Input Voltage to GND

−0.3 V to VDD + 0.3 V

CS Input Voltage to GND

−0.3 V to VDD + 0.3 V

CT and INT Output Voltage to GND

−0.3 V to VDD + 0.3 V

ESD Rating (Human Body Model)

2.0 kV

Operating Temperature Range

−40°C to +150°C

Storage Temperature Range

−65°C to +160°C

Maximum Junction Temperature, TJMAX

150°C

16-Lead LFCSP

Power Dissipation1

WMAX = (TJMAX − TA2)/θJA

Thermal Impedance3

θJA, Junction-to-Ambient (Still Air)

121°C/W

θJC, Junction-to-Case

56°C/W

IR Reflow Soldering

220°C

Peak Temperature (RoHS-

Compliant Package)

260°C (0°C)

Time at Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

−6°C/sec maximum

Time from 25°C to Peak Temperature

8 minutes maximum

1 Values relate to package being used on a standard 2-layer PCB. This gives a

worst-case θJA and θJC.

2 TA = ambient temperature.

3 Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted

components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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