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KM416RD8AS-RBM80 データシート(PDF) 32 Page - Samsung semiconductor

部品番号 KM416RD8AS-RBM80
部品情報  128Mbit RDRAM 256K x 16 bit x 2*16 Dependent Banks Direct RDRAMTM for Consumer Package
PDF  64 Pages
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メーカー  SAMSUNG [Samsung semiconductor]
ホームページ  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KM416RD8AS-RBM80 データシート(HTML) 32 Page - Samsung semiconductor

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Page 29
KM416RD8AS
Direct RDRAM™
Rev. 0.9 July 1999
Target
Initialization (continued)
In essence, the controller must read all the read-only config-
uration registers of all RDRAMs, it must process this infor-
mation, and then it must write all the read-write registers to
place the RDRAMs into the proper operating mode. The
most important of these read-write registers are DEVID (the
device address for memory transactions) and TRDLY
(which sets the delay value for memory read data).
During the initialization process, it is necessary for the
controller to perform 128 current control operations
(3xCAL, 1xCAL/SAM) and one temperature calibrate oper-
ation (TCEN/TCAL) after reset or after powerdown (PDN)
exit.
There are two classes of 128Mbit RDRAM. They are distin-
guished by the “S28IECO” bit in the SPD. The behavior of
the RDRAM at initialization is slightly different for the two
types:
S28IECO=0: Upon powerup the device enters ATTN state.
The serial operations SETR, CLRR, and SETF are
performed without requiring a SDEVID match of the SBC
bit (broadcast) to be set.
S28IECO=1: Upon powerup the device enters PDN state.
The serial operations SETR, CLRR, and SETF require a
SDEVID match.
See the document detailing the reference initialization proce-
dure for more information on how to handle this in a system.
After the step of equalizing the total read delay of each
RDRAM has been completed (i.e. after the TCDLY0 and
TCDLY1 fields have been written for the final time), a
single final memory read transaction should be made to each
RDRAM in order to ensure that the output pipeline stages
have been cleared.



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