74LVC2G66

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 5 — 16 June 2010

19 of 26

NXP Semiconductors

74LVC2G66

Bilateral switch

Fig 27. Package outline SOT765-1 (VSSOP8)

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.00

0.85

0.60

0.27

0.17

0.23

0.08

2.1

1.9

2.4

2.2

0.5

3.2

3.0

0.4

0.1

8

°

0

°

0.13

0.1

0.2

0.4

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.40

0.15

Q

0.21

0.19

SOT765-1

MO-187

02-06-07

bp

D

Z

e

0.12

14

8

5

θ

A2

A1

Q

Lp

(A3)

detail X

A

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

SOT765-1

1

pin 1 index