M95040_09 datasheet(38/43 Pages) STMICROELECTRONICS

38 / 43 page

Package mechanical data

M95040, M95020, M95010

38/43

Doc ID 6512 Rev 8

Figure 20.

UFDFPN8 (MLP8) — 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline

Drawing is not to scale.

The central pad (the area delimited by E2 and D2 in the above illustration) is internally pulled to VSS. It

should not be connected to any other voltage or signal line on the PCB, for example during the soldering

process.

Table 23.

UFDFPN8 (MLP8) — 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.55

0.45

0.6

0.0217

0.0177

0.0236

0.02

0.05

0.0008

0.002

0.25

0.2

0.3

0.0098

0.0079

0.0118

1.9

2.1

0.0787

0.0748

0.0827

1.6

1.5

1.7

0.063

0.0591

0.0669

2.9

3.1

0.1181

0.1142

0.122

0.2

0.1

0.3

0.0079

0.0039

0.0118

0.5

0.0197

0.45

0.4

0.5

0.0177

0.0157

0.0197

0.15

0.0059

0.3

0.0118

ddd(2)

Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.08

UFDFPN-01

ddd

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