IRDC3841W

10/26/2009

Stencil Design

•

The Stencil apertures for the lead lands should be approximately 80% of the area of the

lead lads. Reducing the amount of solder deposited will minimize the occurrences of lead

shorts. If too much solder is deposited on the center pad the part will float and the lead

lands will be open.

•

The maximum length and width of the land pad stencil aperture should be equal to the

solder resist opening minus an annular 0.2mm pull back to decrease the incidence of

shorting the center land to the lead lands when the part is pushed into the solder paste.