Philips Semiconductors

PCKEL14

2.5 V/3.3 V PECL/ECL 1:5 clock distribution chip

Product data

Rev. 01 — 14 October 2002

11 of 15

9397 750 09564

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

Fig 7.

TSSOP20 package outline (SOT360-1).

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

6.6

6.4

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.5

0.2

8

0

o

o

0.13

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1

MO-153

95-02-04

99-12-27

D

Z

e

0.25

110

20

11

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

A

max.

1.10