SPZB260 datasheet(10/15 Pages) STMICROELECTRONICS

部品番号	SPZB260

部品情報	ZigBee® module

PDF	15 Pages

Scroll/Zoom	100%

メーカー	STMICROELECTRONICS [STMicroelectronics]

ホームページ	http://www.st.com

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10 / 15 page

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Soldering

SPZB260

10/15

Soldering

Soldering phase has to be execute with care: in order to avoid undesired melting

phenomenon, particular attention has to be take on the set up of the Peak Temperature.

Here following some suggestions for the temperature profile based on

IPC/JEDEC J-STD-020C, July 2004 recommendations.

Figure 5.

Soldering

Table 7.

Soldering

Profile feature

PB free assembly

Average ramp up rate (TSMAX to TP)

3 °C / sec max

Preheat

Temperature min (TS MIN)

Temperature max (TS MAX)

Time (TS MIN to TS MAX) (tS)

150 °C

200 °C

60 – 100 sec

Time maintained above:

Temperature TL

Time tL

217 °C

40 – 70 sec

Peak temperature (Tp)

240+0 °C

Time within 5 °C of actual peak temperature (tP)

10 – 20 sec

Ramp down rate

6 °C / sec

Time from 25 °C to peak temperature

8 minutes max

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