DS30817 Rev. 6 - 2

1 of 4

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BC847CDLP

© Diodes Incorporated

BC847CDLP

NPN DUAL SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Ideally Suited for Automated Assembly Processes

•

Lead Free By Design/RoHS Compliant (Note 1)

•

"Green" Device (Note 2)

•

Ultra Low Profile Package

Mechanical Data

•

Case: DFN1310H4-6

•

Case Material: Molded Plastic, “Green” Molding

Compound. UL Flammability Classification Rating

94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish

⎯ NiPdAu annealed over Copper

leadframe (Lead Free Plating). Solderable per MIL-

STD-202, Method 208

•

Marking Code Information: See Page 4

•

Ordering Information: See Page 4

•

Weight: 0.0015g (approximate)

* Dimensions D, K, L, N Repeat 4X

** Dimensions E, M, Z Repeat 2X

DFN1310H4-6

Dim

Min

Max

Typ

A

1.25

1.38

1.30

B

0.95

1.08

1.00

C

0.20

0.30

0.25

D*

-

-

0.10

E**

-

-

0.20

G

-

0.40

-

H

0

0.05

0.02

K*

0.10

0.20

0.15

L*

0.30

0.50

0.40

M**

-

-

0.35

N*

-

-

0.25

Z**

-

-

0.05

All Dimensions in mm

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

50

V

Collector-Emitter Voltage

45

V

Emitter-Base Voltage

6.0

V

Collector Current

100

mA

Power Dissipation (Note 3)

350

mW

Thermal Resistance, Junction to Ambient (Note 3)

357

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. No purposefully added lead.

2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3. Device mounted on FR-4 PCB pad layout as shown on page 4.

4. Radiused pad feature is intended for device manufacturing control and should not be considered as a polarity indicator, or to suggest orientation of

the devices in the carrier tape.

C

B

B

E

E

C

Internal Schematic

(TOP VIEW)

Bottom View

Side View

G

H

B

K

E

C

D

Top View

A

L

L

N

M

N

C

E

B

C

E

B

D

Z

Z

R0.1

50

Note

4