Any changing of specification will not be informed individual

http://www.SeCoSGmbH.com

L

A

B S

G

V

3

1

2

K

J

C

H

D

Top View

Dim

Min

Max

A

2.800

3.040

B

1.200

1.400

C

0.890

1.110

D

0.370

0.500

G

1.780

2.040

H

0.013

0.100

J

0.085

0.177

K

0.450

0.600

L

0.890

1.020

S

2.100

2.500

V

0.450

0.600

All Dimension in mm

SOT-23

Surface Mount Switching Diode

BAS19

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

Vdc

Peak Forward Current

IF

200

mAdc

Peak Forward Surge Current

IFM(surge)

500

mAdc

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Total Device Dissipation FR– 5 Board(1)

TA = 25°C

Derate above 25

°C

PD

225

1.8

mW

mW/

°C

Thermal Resistance, Junction to Ambient

RqJA

556

°C/W

Total Device Dissipation

Alumina Substrate,(2) TA = 25°C

Derate above 25

°C

PD

300

2.4

mW

mW/

°C

Thermal Resistance, Junction to Ambient

RqJA

417

°C/W

Junction and Storage Temperature

TJ, Tstg

– 55 to +150

°C

DEVICE MARKING

BAS19 = JP

Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS

Reverse Voltage Leakage Current

(VR = 100 Vdc,TJ = 25

(VR = 100 Vdc, TJ = 150°C)

(VR = 25 Vdc, TJ = 150°C)

IR

—

—

—

0.1

100

40

µAdc

Reverse Breakdown Voltage

(IBR = 100 µAdc)

V(BR)

120

—

Vdc

Forward Voltage

(IF = 1.0 mAdc)

(IF = 10 mAdc)

(IF = 100 mAdc)

(IF = 200 mAdc)

VF

—

—

—

—

715

855

1000

1250

mV

Diode Capacitance

(VR = 0, f = 1.0 MHz)

CD

—

5.0

pF

Reverse Recovery Time

(IF = IR = 30 mAdc, RL = 100 Ω)

trr

50

ns

1.FR–5 = 1.0 X 0.75 X 0.062 in. 2.Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.

FEATURES

·

Fast Switching Speed

·

Surface Mount Package Ideally Suited for

Automatic Insertion

·

For General Purpose Switching Applications

·

High Conductance

1

ANODE

3

CATHODE

1

2

3

Elektronische Bauelemente

120

01-Jun-2002 Rev. A

Page 1 of 2

RoHS Compliant Product

A suffix of "-C" specifies halogen & lead-free