TESDL5V0/TESDL12V/TESDL24V

Bi-directional ESD Protection Diode

Small Signal Diode

Applications Information

Designed to protect sensitive electronics from damage or latch-up due to ESD

Designed to replace multilayer varistors (MLVs) in portable applications

Features large crosssectional area junctions for conducting high transient currents

Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs

Circuit Board Layout Recommendations

Tape & Reel specification

Symbol

Dimension

(mm)

Carrier width

A

1.55 ± 0.10

Reel width

W1

13.5 Max

Overall tape thickness

T

0.23 ± 0.05

Tape width

W

8.00 ±0.20

Sprocke hole pitch

P0

4.00 ±0.10

Embossment center

P1

2.00 ±0.05

Punch hole position

F

3.50 ±0.05

Punch hole pitch

P

4.00 ±0.10

Feed hole width

D2

13.0 ± 0.20

Sprocke

t hole position

E

1.75 ±0.10

Reel outside diameter

D

178 ± 1

Reel inner diameter

D1

60.0 Min

Carrier depth

C

1.05 ± 0.10

Sprocket hole

d

1.55 ± 0.05

Carrier length

B

2.65 ± 0.10

Minimize the path length between the ESD Protection Diode and the protected line.

Minimize all conductive loops including power and ground loops.

The ESD transient return path to ground should be kept as short as possible.

Never run critical signals near board edges.

Use ground planes whenever possible.

Item

Designed to protect one data, I/O, or power supply line.

The combination of small size and high ESD surge capability makes them ideal for use in portable applications.

Good circuit board layout is critical for the suppression of ESD induced transients.

Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling.

Top Cover Tape

Carieer Tape

Any Additional Label (If Required)

TSC label

W1

D1

D2

D

T

C

d

P1

P0

A

B

F

W

E

Direction of Feed

Version : C1

1