New Product

SS8P2L, SS8P3L

Vishay General Semiconductor

www.vishay.com

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Document Number: 89001

Revision: 24-Nov-09

4

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Conform to JEDEC TO-277A

TO-277A (SMPC)

0.016 (0.40)

0.006 (0.15)

0.047 (1.20)

0.039 (1.00)

0.146 (3.70)

0.134 (3.40)

0.087 (2.20)

0.075 (1.90)

0.189 (4.80)

0.173 (4.40)

0.049 (1.24)

0.037 (0.94)

0.053 (1.35)

0.041 (1.05)

0.030 (0.75) NOM.

0.084 (2.13) NOM.

0.155 (3.94)

NOM.

Mounting Pad Layout

0.268

(6.80)

0.186 (4.72)

MIN.

0.050 (1.27)

MIN.

0.041

(1.04)

0.055 (1.40)

MIN.

0.189 (4.80)

MIN.

0.187 (4.75)

0.175 (4.45)

0.262 (6.65)

0.250 (6.35)

0.242 (6.15)

0.238 (6.05)

0.171 (4.35)

0.167 (4.25)

K

2

1