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©2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

SPA™ Silicon Protection Array Products

Surface Mount TVS Avalanche Diode Array

SP050xBA Lead-Free/Green Series

Typical Input VI Characteristics

(Pulse-mode measurements, pulse width = 0.7 mS nominal)

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-0.2

-0.4

-0.6

-0.8

-1.0

-1.2

-1.4

-1.6

Input Voltage (V)

8

7

6

5

4

3

2

1

0

-1

-2

-3

9

Typical Diode Capacitance vs. Reverse Voltage

Diode Reverse Voltage (V)

0

1

2

3

4

5

0

20

40

60

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

5°C/second max

T

5°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters - Wave Soldering