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CPC3710 データシート(PDF) 4 Page - Clare, Inc.

部品番号 CPC3710
部品情報  N-Channel Depletion-Mode FET
PDF  5 Pages
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メーカー  CLARE [Clare, Inc.]
ホームページ  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC3710 データシート(HTML) 4 Page - Clare, Inc.

  CPC3710 Datasheet HTML 1Page - Clare, Inc. CPC3710 Datasheet HTML 2Page - Clare, Inc. CPC3710 Datasheet HTML 3Page - Clare, Inc. CPC3710 Datasheet HTML 4Page - Clare, Inc. CPC3710 Datasheet HTML 5Page - Clare, Inc.  
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PRELIMINARY
4
R00D
CPC3710
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC3710C
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC3710C
260ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable,
and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not
be used. Cleaning methods that employ ultrasonic energy should not be used.
RoHS
2002/95/EC
e3
Pb



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