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ADP7104ARDZ-3.0-R7 データシート(PDF) 22 Page - Analog Devices

部品番号 ADP7104ARDZ-3.0-R7
部品情報  20 V, 500 mA, Low Noise, CMOS LDO
PDF  28 Pages
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

ADP7104ARDZ-3.0-R7 データシート(HTML) 22 Page - Analog Devices

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ADP7104
Data Sheet
Rev. B | Page 22 of 28
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise (see Figure 76 and Figure 77).
Maximum junction temperature (TJ) is calculated from
the board temperature (TB) and power dissipation (PD)
using the following formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP package
and 31.3°C/W for the 8-lead SOIC package.
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 76. LFCSP
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 77. SOIC



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