ADP2325ACPZ-R7 datasheet(6/32 Pages) AD

6 / 32 page

ADP2325

Data Sheet

Rev. 0 | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN1, PVIN2, EN1, EN2

−0.3 V to +22 V

SW1, SW2

−1 V to +22 V

BST1, BST2

VSW + 6 V

FB1, FB2, SS1, SS2, COMP1, COMP2,

PGOOD1, PGOOD2, TRK1, TRK2, SCFG,

SYNC, RT, MODE

−0.3 V to +6 V

INTVCC, VDRV, DL1, DL2

−0.3 V to +6 V

PGND to GND

−0.3 V to +0.3 V

Temperature Range

Operating (Junction)

−40°C to +125°C

Storage

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Boundary Condition

θJA is measured using natural convection on a JEDEC 4-layer

board, and the exposed pad is soldered to the printed circuit

board (PCB) with thermal vias.

Table 3. Thermal Resistance

Package Type

θJA

Unit

32-Lead LFCSP_WQ

32.7

°C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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