LT3517

17

3517ff

PACKAGE DESCRIPTION

4.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.55

±0.20

16

15

1

2

BOTTOM VIEW—EXPOSED PAD

2.15

±0.10

(4-SIDES)

0.75

±0.05

R = 0.115

TYP

0.30

±0.05

0.65 BSC

0.200 REF

0.00 – 0.05

(UF16) QFN 10-04

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.72

±0.05

0.30

±0.05

0.65 BSC

2.15

±0.05

(4 SIDES)

2.90

±0.05

4.35

±0.05

PACKAGE OUTLINE

PIN 1 NOTCH R = 0.20 TYP

OR 0.35

× 45° CHAMFER

UF Package

16-Lead Plastic QFN (4mm

× 4mm)

(Reference LTC DWG # 05-08-1692 Rev Ø)