SP207ECT datasheet(9/16 Pages) SIPEX

9 / 16 page

SP207EDS/09

SP207E Series High Performance Transceivers

WAKEUP FUNCTION

The SP213E has a wake–up feature that keeps

two receivers (R

4 and R5) in an enabled state

when the device is in the shutdown mode. With

only the receivers active during shutdown, the

devices draw 5–10

µA of supply current.

A typical application of this function would be

where a modem is interfaced to a computer in a

power–down mode. The ring indicator signal

from the modem could be passed through an

active receiver in the SP213E that is itself in the

shutdown mode. The ring indicator signal would

propagate through the SP213E to the power

management circuitry of the computer to power

up the microprocessor and the SP213E drivers.

After the supply voltage to the SP213E reaches

+5.0V, the SHUTDOWN pin can be disabled,

taking the SP213E out of the shutdown mode.

All receivers that are active during shutdown

maintain 500mV (typ.) of hysteresis.

ESD TOLERANCE

The SP207E Family incorporates ruggedized

ESD cells on all driver output and receiver input

pins. The ESD structure is improved over our

previous family for more rugged applications

and environments sensitive to electro-static

discharges and associated transients. The

improved ESD tolerance is at least +15kV

without damage nor latch-up.

SW1

SW2

Device

Under

Test

DC Power

Source

SW1

SW2

There are different methods of ESD testing

applied:

a) MIL-STD-883, Method 3015.7

b) IEC1000-4-2 Air-Discharge

c) IEC1000-4-2 Direct Contact

The Human Body Model has been the generally

accepted ESD testing method for semiconductors.

This method is also specified in MIL-STD-883,

Method 3015.7 for ESD testing. The premise of

this ESD test is to simulate the human body’s

potentialtostoreelectro-staticenergyanddischarge

it to an integrated circuit. The simulation is

performed by using a test model as shown in

Figure 7. This method will test the IC’s capability

to withstand an ESD transient during normal

handling such as in manufacturing areas where the

ICs tend to be handled frequently.

TheIEC-1000-4-2,formerlyIEC801-2,isgenerally

used for testing ESD on equipment and systems.

For system manufacturers, they must guarantee a

certain amount of ESD protection since the system

itself is exposed to the outside environment and

human presence. The premise with IEC1000-4-2

is that the system is required to withstand an

amount of static electricity when ESD is applied to

points and surfaces of the equipment that are

accessible to personnel during normal usage. The

transceiver IC receives most of the ESD current

when the ESD source is applied to the connector

pins. The test circuit for IEC1000-4-2 is shown on

Figure 8. There are two methods within IEC1000-

4-2, the Air Discharge method and the Contact

Discharge method.

Figure 7. ESD Test Circuit for Human Body Model

SP207ECT データシート(PDF) 9 Page - Sipex Corporation

SP207ECT データシート(HTML) 9 Page - Sipex Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

データシートダウンロード