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AD8137WYCPZ-R7 データシート(PDF) 29 Page - Aavid, Thermal Division of Boyd Corporation

部品番号 AD8137WYCPZ-R7
部品情報  Low Cost, Low Power, Differential ADC Driver
PDF  32 Pages
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メーカー  AAVID [Aavid, Thermal Division of Boyd Corporation]
ホームページ  https://www.boydcorp.com/aavid.html
Logo AAVID - Aavid, Thermal Division of Boyd Corporation

AD8137WYCPZ-R7 データシート(HTML) 29 Page - Aavid, Thermal Division of Boyd Corporation

Back Button AD8137WYCPZ-R7 Datasheet HTML 24Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 25Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 26Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 27Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 28Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 29Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 30Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 31Page - Aavid, Thermal Division of Boyd Corporation AD8137WYCPZ-R7 Datasheet HTML 32Page - Aavid, Thermal Division of Boyd Corporation  
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Data Sheet
AD8137
Rev. E | Page 29 of 32
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8
5
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 72. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.55
1.45
1.35
1.84
1.74
1.64
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT
TO JEDEC STANDARDS MO-229-WEED
PIN 1
INDICATOR
(R 0.15)
Figure 73. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-13)
Dimensions shown in millimeters



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