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MBR5H100MFS データシート(PDF) 4 Page - ON Semiconductor |
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MBR5H100MFS データシート(HTML) 4 Page - ON Semiconductor |
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4 / 5 page ![]() MBR5H100MFS, NRVB5H100MFS http://onsemi.com 4 TYPICAL CHARACTERISTICS Figure 7. Forward Current Derating Over Case Temperature Figure 8. Forward Current Derating Over Ambient Temperature TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) 175 170 165 160 155 150 0 1 2 4 5 6 8 9 180 140 120 100 80 40 20 0 0 1 2 3 4 5 6 Figure 9. Maximum Forward Power Dissipation Figure 10. Steady State Junction to Ambient Thermal Resistance IF, AVERAGE RECTIFIED FORWARD CURRENT (A) COPPER HEAT SPREADER AREA (mm2) 5 4 3 2 1 0 0 1 2 3 600 500 700 400 300 200 100 0 0 20 40 60 80 100 120 140 Figure 11. Transient Thermal Response, Junction to Case PULSE TIME (sec) 0.01 0.001 0.0001 0.00001 0.000001 0.01 0.1 1 10 3 7 RqJC = 1°C/W DC Square Wave 60 160 RqJA = 49°C/W Square Wave DC TJ = 175°C Square Wave DC 1 oz. Copper PCB 2 oz. Copper PCB Assumes 25°C Ambient Temperature Assumes 25°C ambient and soldered to a 600 mm2 − 1 oz copper pad on PCB 0.1 1 10 100 1000 50% Duty Cycle Single Pulse 20% 10% 5% 2% 1% |
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