Characteristics

STPS2L60

4/9

Doc ID 9173 Rev 6

Figure 7.

Non repetitive surge peak forward

current versus overload duration

(maximum values) (DO-41)

Figure 8.

Non repetitive surge peak forward

current versus overload duration

(maximum values) (SMB flat)

I (A)

M

0

1

2

3

4

5

6

7

8

9

10

1.E-03

1.E-02

1.E-01

1.E+00

t

t(s)

T =25°C

a

T =125°C

a

T =75°C

a

0

5

10

15

20

25

30

1.E-03

1.E-02

1.E-01

1.E+00

T

T

T

SMBflat

I (A)

M

t(s)

t

Figure 9.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

Figure 10.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (DO-41)

Z/R

th(j-a)

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

t (s)

p

Single pulse

epoxy printed circuit board FR4, copper thickness: 35 µm

Z/R

th(j-a)

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

p

Single pulse

Figure 11.

Relative variation of thermal

impedance junction to lead versus

pulse duration (SMB flat)

Figure 12.

Reverse leakage current versus

reverse voltage applied

(typical values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

Single pulse

Z/R

th(j-l)

th(j-l)

t (s)

p

epoxy printed circuit board FR4, copper thickness: 35 µm

I (µA)

R

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

0

102030

405060

V (V)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =75°C

j

T =50°C

j

T =25°C

j