Package mechanical data

STEVAL-TDR003V1

16/20

Doc ID 17343 Rev 1

6.2

Thermal pad and via design - SOT-89

Thermal vias are required in the PCB layout to effectively conduct heat away from the

package. The via pattern has been designed to address the thermal, power dissipation and

electrical requirements of the device.

The via pattern is based on through-hole vias with 0.203 mm to 0.330 mm finished hole size

on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in

a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve

similar results.

Figure 21.

Pad layout details